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Oleh   Ahmad Abror [13116109]
Kontributor / Dosen Pembimbing : Dr. Ir. Nathanael Panagung Tandian, M.Sc.;
Jenis Koleksi : S1-Tugas Akhir
Penerbit : FTMD - Teknik Mesin
Fakultas : Fakultas Teknik Mesin dan Dirgantara (FTMD)
Subjek :
Kata Kunci : TEG, open-circuit voltage, finite element analysis
Sumber :
Staf Input/Edit : Alice Diniarti  
File : 1 file
Tanggal Input : 2021-03-15 23:04:48

Energy has been amongst the most essential resources that endorses the progress, evolution, and prosperity of human societies. There are various ways to supply energy for human population and one of them is using thermoelectric generator (TEG). TEG is a device that generates electricity by means of Seebeck effect. TEG converts temperature difference along the device into electricity. In this research, two TEG chips were used as parts of a waste heat recovery system of an atmospheric pressure plasma jet (APPJ). The APPJ is used for coating process on a glass. Prediction of the open-circuit voltage and thermal analysis of this TEG-based waste heat recovery system was the objectives of this research. The heat transfer of this process was simulated as a tool to crosscheck the experiment of recovering heat from the APPJ process using TEG. The TEG was modelled as a three-layer cuboid consisting of one thermoelectric-leg layer and two ceramics layers. The air gap between TEG chips and other components were modelled as a contact thermal resistance (CTRs). The airflow was excluded in calculation domain, but the convection was considered in boundary condition of the calculation. To calibrate the CTRs, a heat gun was used as a static heat source. Using the calibrated parameters, TEG-APPJ waste heat recovery was simulated using a finite element analysis software. The heat input was modelled using Gaussian heat distribution. The simulation temperature and open-circuit voltage provided good agreement with the experiment data. There was overshoot in the open-circuit voltage after reaching its maximum value, 8 V. The temperature distribution was learned to be highly affected by widest air gap between the TEG and vacuum plate.