COVER Jyesta Mahayu Adhidewata
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» Gedung UPT Perpustakaan
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» Gedung UPT Perpustakaan
BAB 1 Jyesta Mahayu Adhidewata
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» Gedung UPT Perpustakaan
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» Gedung UPT Perpustakaan
BAB 2 Jyesta Mahayu Adhidewata
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» Gedung UPT Perpustakaan
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» Gedung UPT Perpustakaan
BAB 3 Jyesta Mahayu Adhidewata
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» Gedung UPT Perpustakaan
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» Gedung UPT Perpustakaan
BAB 4 Jyesta Mahayu Adhidewata
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» Gedung UPT Perpustakaan
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» Gedung UPT Perpustakaan
PUSTAKA Jyesta Mahayu Adhidewata
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» Gedung UPT Perpustakaan
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» Gedung UPT Perpustakaan
Thermoelectric materials can convert heat into electricity, or conversely, produce
heating or cooling from electrical current. However, the potential applications of
thermoelectric materials to date are limited due to the low efficiency (expressed by
the dimensionless quantitiy known as figure of merit, ZT ) of existing thermoelectric
materials. One of the proposed methods for obtaining high efficiency thermoelectric
material is by using a pudding mold band structure, that is, a material where the
energy dispersion of the bands depend on the fourth or greater power of the wave
number. In this final project, we consider the effects of a pudding mold type band
structure to the thermoelectric properties of the material. Furthermore, it has been
observed that a high figure of merit can be obtained by tuning the band gap of the
material to an optimum value. Therefore, we also consider the effect of the band gap
to the thermoelectric properties of the material. We also calculate the thermoelectric
properties of 2D and 1D materials. To calculate the thermoelectric properties of the
material, we use the Boltzmann transport theory with the relaxation time approximation.
The required numerical calculations are done using the SciPy library of the
Python programming language. We also calculate the thermoelectric properties of
real life pudding mold material such as FeAs2 and PtS2 using Quantum ESPRESSO
and BoltzTraP software. The results of the calculations show that the pudding mold
band structure produces a higher electrical and thermal conductivity than a parabolic
band, but no significant difference is found between the Seebeck coefficient for the
pudding mold band structure and the Seebeck coefficient of the parabolic band.
Meanwhile, variation of the band gap shows that increasing the band gap will
increase the figure of merit up until around 5kBT , where further increase of the band
gap will not increase the figure of merit. Another interesting result is the increase
in figure of merit obtained when the shape of conduction band is different from the
shape of the valence band. We found that the results for two dimensional materials
are similar to the result for 3D material, but surprisingly we found that the figure
of merit for 1D material with parabolic bands is higher than for 1D material with
pudding mold band due to its higher density of states. From the calculations using
real materials, we found that our pudding mold materials exhibit a higher figure
of merit compared to silicon (parabolic band). We can conclude that to maximize
the figure of merit we need a material with a pudding mold type band structure
and a high band gap, or otherwise, for a low band gap material, a higher figure of
merit can be achieved by using an asymmetrical conduction band and valence band
structure.